SUMMIT 400 system

• Max. PCB size: 508 x 457 cm 
• Max. component size: 50 mm 
• Pre heaters: 
  • top: convective 1.0 kW (option 2.0 kW)
  • bottom: 470 x 290 cm, (1.5 kW or 3.0 kW -
    depending on model)

• Assembly and disassembly wide range of components types: BGA, µBGA, CSP, Flip Chip, Connectors, PLCC.

• Exceptional solution of fully automatic assembly/disassembly profiles programming 
• Perfect component placement accuracy: 50 µm 
• Highest quality optics
• Patent technique of overlapping images helping in components positioning  
• Digital image processing 
• Wide viewing area
• Automatic component feeder 
• Shock-proof PCB support  
• User friendly, intuitive and rich in possibilities system controlling software (Windows based)

		Automatic creation of soldering profiles with an intuitive graphical user interface
		Precision gantry allowing adjustment of X, Y, Z axes
		The optical system for BGA/CSP components positioning (screenshot of the monitor)
		Four-LED lights, high intensity of emitted light Optimally selected lighting and a prisms system, magnification allows to get very high quality image of PCB pins and pads.
		High-resolution colour CCD camera, mirrors and prisms systems Top and bottom lighting are independently adjustable to provide effect of component and board imposed images for more precise positioning.

Technical data

Technical data 400M 400R Base 686 x 737 mm Max. PCB size 508 x 457 mm Min. component size 5 mm Max. component size 50 mm Positioning accuracy 5 µm Vision system LED lighting, CCD matrix (optional system with improved resolution and with greater magnification) Top pre heater Convection 1.0 kW  (optional 2.0 kW) Convection 1.0 kW (optional 2.0 kW) Bottom pre heater Infrared emitter  (IR) 1.5 kW (optional 3.0 kW)  dimensions  470 x 290 mm Infrared emitter  (IR) 3.0 kW (optional 6.0 kW)  dimensions  470 x 290 mm